Geringer Halbleitertechnik GmbH & Co. KG is proud to announce that it has concluded an exclusive sales partnership with F & K Delvotec Bondtechnik GmbH. Effective immediately, F & K Delvotec will be providing demonstrations, sales and service support for Geringer’s die bonders in the U.S. and Canada.
Geringer designs and builds extremely versatile multi-chip die-bonders for demanding applications in semiconductor and electronics technology. The two main variants, a single-head and a double-head model, are capable of processing a large number of different die types on large substrates or other package types, using adhesive, solder paste or even eutectic attachment processes. With this equipment which is targeted especially towards high-mix/low-volume applications, Geringer is continuing an earlier tradition of F & K Delvotec. These die-bonders are a perfect complement to Delvotec's range of wire bonders for toughest quality requirements and challenging technologies in the electronics and semiconductor industries.
Contact: F&K Delvotec Inc. 27182 Burbank Avenue Foothill Ranch, CA 92610, USA